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this is information on a product in full production. february 2014 docid024711 rev 6 1/32 stcc2540 usb charging controller with integrated power switch datasheet - production data features ? compliant with usb char ging specifications bc1.2, usb 2.0 and usb 3.0 standards ? compliant with chinese telecommunications industry standard yd/t 1591-2009 ? compatible with proprietary charging mode (apple ? 1 a / 2 a, blackberry ? , korean tablets) ? wide bandwidth, low-loss usb 2.0 data switch ? integrated v bus power switch with low r on of 65 m ? constant current mode overcurrent protection ? soft-start to limit inrush current ? adjustable current limit up to 2.8 a ? short-circuit, thermal and undervoltage protection ? reverse voltage and reverse current protection ? deglitched fault reporting output ? supports remote wakeup in s3 ? charging indication output in dcp and cdp modes ? package: vfqfpn 16l 3 x 3 x 0.8 mm with exposed pad ? temperature range: -40 up to 85 c ? ul and cb recognized components (ul file number: e354278) applications ? usb ports / hubs ? personal computers, all-in-one pcs ? monitors ? notebooks, ultrabooks ? tablet pcs ? universal wall charging adapters description the stcc2540 device integrates, in one package, a usb charger controller, a wide bandwidth data switch, and a high current power switch. the device emulates several profiles compatible with the usb battery charging standard, bc1.2, chinese telecommunications standard yd/t 1591-2009, and proprietary charger modes. the device asserts the charging flag in dcp modes if the charging current is higher than the threshold. in cdp mode, it asserts the charging flag after the cdp negotiation if the charging current is higher than the threshold. after the current drops below the threshold, the output is deasserted, allowing the host to turn off the high power dc-dc converter and reduce overall consumption in s4/s5 states, which is critical when the host is battery supplied. vfqfpn 16l 3 x 3 x 0.8 mm www.st.com
contents stcc2540 2/32 docid024711 rev 6 contents 1 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 absolute maximum ratings and operating c onditions . . . . . . . . . . . . . 6 4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.1 supported modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5.2 remote wakeup in s3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.3 v bus discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5.4 state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5.5 charging detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.6 power switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 overcurrent conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 thermal protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 undervoltage lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 fault functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 current limit programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.7 enable input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.8 input and output capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
docid024711 rev 6 3/32 stcc2540 functional description 32 1 functional description the stcc2540 device integrates, in one packa ge, a complete solution to charge portable devices through usb ports, including: ? charger emulator compatible with usb ba ttery charging bc1.2 standard, chinese telecommunications standard yd/t 1591-2009 and proprietary charger such as apple ? divider mode, blackberry ? and korean tablet charging mode. ? 3 control pins, ctl1, ctl2, ctl3 allowing th e host to select the emulation profile. these pins may be controlled directly from the host usb controller or from the embedded controller. ? usb data switch with wide bandwidth up to 1100 mhz compliant with usb 2.0 standard. this wide bandwidth switch features low capacitance and low r on resistance, allowing signals to pass with minimum edge and phase distortion. ? n-channel power switch with low r on resistance of 65 m typ., high current limiter accuracy and high current out put capability, 2.5 a typ. the current limit threshold can be adjusted with a good accuracy by an extern al resistor in the range 500 ma to 2.8 a (max.). constant current mode protection is used to protect the device and the host system against overcurrent or short-circuit. othe r protection includes reverse current and reverse voltage protection, undervoltage lockout and thermal shutdown. ? a deglitched output (fault ) reporting the failure events of overcurrent, thermal shutdown and reverse current (backdrive) to v in . ? charging current sensing ci rcuit. the output charging is asserted if charging current is above 20 ma in cdp and dcp modes. in cdp mode the charging flag is s asserted only if the cdp handshaking between the portable device and the host is performed before the current is above threshold. after the current drops below th reshold, the output charging is deasserted. the host system can then disable the high power dc -dc converter and thus reduce the power consumption. this is crucial w hen the host is battery supplied. ? an enable input (en) to enable/disable the device. the device is offered in a small, rohs compliant vfqfpn 16l (3 x 3 x 0.8 mm) package with an exposed pad for effective cooling.
functional description stcc2540 4/32 docid024711 rev 6 figure 1. block diagram figure 2. pinout $09 '3b287 '0b287 )$8/7 &+$5*,1* , /,0 (1 &7/ &7/ &7/ ,1 9 ,1 (pxodwlrq surilohv /rjlffrqwuro 3rzhu vzlwfk 89/2 7khupdofrqwuro 5hyhuvh fxuuhqw '3b,1 '0b,1 287 *1' 86%gdwd vzlwfk 9 ,1 9 ,1 9 ,1 2xwsxw glvfkdujh $09 ([srvhg wkhupdosdg *1' ,1 '0b287 '3b287 1& 287 '0b,1 '3b,1 &+$5*,1* (1 &7/ &7/ &7/ , /,0 1& *1' )$8/7
docid024711 rev 6 5/32 stcc2540 pin description 32 2 pin description table 1. pin description pin no. name type description 1 in pwr device and usb port power supply input 2, 3 dm_out, dp_out i/o usb 2.0 data connection to syst em usb transmitter (dm = d-, dp = d+) 4 nc - not connected 5eni logic level control input. when en is low, power switch, data switch and emulator are off. 6, 7, 8 ctl1, ctl2, ctl3 i logic level co ntrol inputs to select charger mode (see table 5 ). 9 charging o active low open drain output, asserted when charging current is detected. 10, 11 dp_in, dm_in i/o usb 2.0 data connection to syst em usb connector (dm = d-, dp = d+) 12 out pwr usb port power supply output (v bus ) 13 fault o active low open drain output, asserted when overcurrent, overtemperature or reverse voltage are detected. 14 gnd - ground 15 nc - not connected 16 i lim i current limit threshold programming resistor terminal.
absolute maximum ratings and operating conditions stcc2540 6/32 docid024711 rev 6 3 absolute maximum ratings and operating conditions stressing the device beyond the rating listed in table 2: absolute maximum ratings (amr) may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in table 3: operating conditions is not implied. exposure to abso lute maximum rating conditions for extended periods may affe ct device reliability. table 2. absolute maximum ratings (amr) symbol parameter value unit v in , v out supply voltage -0.3 to 6.5 v v en , v ctlx logical input voltage -0.3 to 6.5 v fault , v charging pull-up voltage (fault , charging ) -0.3 to 6.5 v dp_out , v dm_out , v dp_in , v dm_in data switch pin voltage to ground -0.3 to v in +0.3 i dp_out , i dm_out , i dp_in , i dm_in data switch current, switch on 50 ma i o(out) maximum power switch outp ut current, power switch on internally limited - i o(fault ) , i o(charging ) logical output sink current 25 ma t stg storage temperature (v in off) -55 to +150 c t sld lead solder temperature for 10 seconds temperature (v in off) (1) 260 r thja thermal resistance junction-to-ambient vfqfpn 16l (2) 60 c/w t j maximum junction temperature (internally limited) -40 to t stop c v esd(out, dp_in, dm_in) iec61000-4-2 contact discharge (out, dp_in, dm_in pins) 8 kv v esd jedec human body model (all pins) (3) 2 jedec machine model (all pins) 200 v 1. reflow at temperature of 255 to 260 c for time < 30 seconds (total thermal budget not to exceed 180 c for a period from 90 to 150 seconds). 2. r th are typical values, given when m ounted on a 4-layer pcb with vias. 3. measured in recommended application circuit with 1 f ceramic capacitor + 150 f low esr electrolytic capacitor connected between out and gnd pins (see figure 4: typical application diagram ). table 3. operating conditions symbol parameter value unit v in supply voltage 4.5 to 5.5 v t a ambient operating temperature -40 to +85 c t j junction operating temperature -40 to +125
docid024711 rev 6 7/32 stcc2540 electrical characteristics 32 4 electrical characteristics table 4. electrical characteristics v in = 4.5 to 5.5 v, -40 c < t j < 125 c (unless otherwise specified) symbol parameter conditions min. typ. max. unit current consumption i active supply current in active state (en = 1) mode cdp (111) 110 160 a mode sdp (110 - 010) 100 150 mode dcp auto-detect (001) ? divider mode ?bc1.2 260 110 290 180 mode dcp bc1.2 (100) 110 180 mode dcp divider (101) 210 290 i disabled supply current in disable state en = 0, t j = 25 c 0.2 5 t j = 125 c 60 power switch - dc parameters r on static on-resistance t j = 25 c 65 m -40 c < t j < 125 c 95 i reverse reverse leakage current in disabled state (absolute value) v out = 5.5 v, v in = 0, v en = 0, t j = 25 c, measured at in 15 a t j = 125 c, other conditions the same as above 70 v reverse reverse voltage protection threshold (v out - v in ) v uvlo < v in < v out , en = 1, power switch on -> off 60 mv i os current limiter threshold r ilim = 96 k 340 500 625 ma r ilim = 33 k 1290 1450 1595 r ilim = 19.6 k 2255 2450 2645 r ilim = 17.2 k 2800 t stop thermal shutdown threshold 140 150 160 c t hyst thermal shutdown hysteresis 20 i en en input leakage current v in = 5.5 v, v en = 0 v or 5 v -1 1 a ven enable input turn-on, turn-off threshold voltage 0.4 1.6 v vhyst(en) enable input turn-on, turn-off voltage hysteresis 500 mv v ol(fault ) fault output low voltage i fault = 1 ma 180
electrical characteristics stcc2540 8/32 docid024711 rev 6 iol(fault ) fault output leakage current v in = 5.5 v, v fault = 5 v 1 a t fault fault output deglitch delay fault assertion / deassertion delay in overcurrent condition 7912ms v uvlo undervoltage lockout v in rising 3.9 4.1 4.3 v v hyst(uvlo) undervoltage lockout hysteresis t j = 25 c 100 mv power switch - ac parameters (1) t on turn on, en to out delay c load = 1 f, r load = 100 0.8 ms t off turn off, en to out delay 0.3 t r out (v bus ) rise time c load = 1 f, r load = 100 0.4 t f out (v bus ) fall time 0.2 t ios current limiter response time to short-circuit v in = 5.5 v 3.5 s output discharge r discharge discharge resistor 140 200 300 high-speed data switch - dc parameters r on data switch on-resistance switch closed, v in = 5 v, i s = 8 ma, test voltage on dp_out, dm_out = 0.4 v 2.5 4 r on data switch on-resistance switch closed, v in = 5 v, i s = 8 ma, test voltage on dp_out, dm_out = 3 v 2.7 4 i off off state leakage current v en = 0 v, vdp/dm_in = 3.6 v, vdp/dm_out = 0 v, measure idp/dm_out 1.5 a high-speed data switch - ac parameters (1) x talk dp, dm crosstalk r term = 50 , c load = 5 pf, v s = 1 v rms, signal = 0 dbm, f = 250 mhz 47 db o irr off state isolation r term = 50 , c load = 5 pf, v s = 1 v rms, signal = 0 dbm, f = 250 mhz 17 b w bandwidth -3 db r term = 50 , c load = 5 pf, signal = 0 dbm 1100 mhz charger emulator - bc1.2 dcp mode r dcp_res dp_in to dm_in short resistance ctlx configured for dcp bc1.2 100 170 table 4. electrical characteristics v in = 4.5 to 5.5 v, -40 c < t j < 125 c (unless otherwise specified) (continued) symbol parameter conditions min. typ. max. unit
docid024711 rev 6 9/32 stcc2540 electrical characteristics 32 charger emulator - divider mode v dm dm_in output voltage device set to dcp auto-detect mode or divider mode, v in = 5.0 v 1.96 2 2.04 v v dp dp_in output voltage 2.65 2.7 2.75 r dm dm_in output resistance device set to dcp auto-detect mode or divider mode 27 k r dp dp_in output resistance 27 charger emulator - bc1.2 cdp mode v dm_src voltage source on dm_in for cdp detection v dp_in = 0.6 v, device in cdp bc1.2 mode 0.5 0.6 0.7 v v dat_ref dp_in rising voltage threshold to turn on v dm_src i dm_in = -250 a, device in cdp bc1.2 mode 0.25 0.32 0.4 v dat_ref_hyst v dat_ref hysteresis 30 mv v lgc_src dp_in rising voltage threshold to turn off v dm_src 0.8 1 v v lgc_src_hyst v lgc_src hysteresis 30 mv i dp_sink dp_in sink current 0.4 < v dp_in < 0.8 v, device in cdp bc1.2 mode 50 75 150 a charger emulator - timings t chg_dgl_on charging indication on deglitch delay from i out > i out _th to charging asserted 0.5 s t chg_dgl_off charging indication off deglitch delay from i out < i out_th to charging deasserted 5 t vdm_src_on dm_in voltage source turn- on time from v dp_in 0 v -> 0.6 v to v dm_in = v dm_src , ctlx configured for cdp bc1.2 8 ms t vdm_src_off dm_in voltage source turn- off time from v dp_in 0.6 v -> 0 v to v dm_in = 0 v, ctlx configured for cdp bc1.2 1.3 t vbus_reapp out discharge pulse width from v out falls to 0.7 v during discharge to v out returning to 90%. 300 350 400 table 4. electrical characteristics v in = 4.5 to 5.5 v, -40 c < t j < 125 c (unless otherwise specified) (continued) symbol parameter conditions min. typ. max. unit
electrical characteristics stcc2540 10/32 docid024711 rev 6 figure 3. ti ming waveforms charger emulator - control pins ctlx v ctlx ctlx pins threshold voltage 0.4 1.6 v v hyst(ctlx) hysteresis voltage on ctlx pins 500 mv i ctlx leakage current v in = 5.5 v, v ctlx = 0 v or 5 v -1 1 a charger emulator - charging indication i out_th output current threshold for charging detection dcp mode, cdp mode 20 ma v ol(charging ) charging output low voltage charging detected (i out > i out_th ), i charging = 1 ma 180 mv i ol(charging ) charging output leakage current v in = 5.5 v, v charging = 5 v 1 a 1. guaranteed by design. not tested in production. table 4. electrical characteristics v in = 4.5 to 5.5 v, -40 c < t j < 125 c (unless otherwise specified) (continued) symbol parameter conditions min. typ. max. unit $09 9 (1[ 9 287[ w rq w rii 9 287 w u w u , 287 , 26 w ,26
docid024711 rev 6 11/32 stcc2540 application information 32 5 application information the stcc2540 device is designed to be implemen ted into the pc on a usb port in order to emulate the wall charger adapter when the pc is in standby mode or off, and to allow higher charge current when the usb interface is used for data communication. in order to handle these functionalities, the stcc2540 device relies on usb bc1.2 specifications, chinese telecommunications industry standard yd/t 1591-2009, and proprietary implementations. ? bc1.2 charging profiles are ? cdp: charging downstream port providing data communication plus charging (active usb data communications with 1.5 a support) ? sdp: standard downstream port providing data communication with no charging (active usb 3.0 data communications with 900 ma support or usb 2.0 data communications with 500 ma support) ? dcp: dedicated charging port (wall char ger emulation with no data communication and 500 ma to 1.5 a support) ? chinese telecommunications standard ? d+ and d- shorted to allow charging ? apple divider mode (2 a max. current) ? blackberry emulator mode ? legacy mode (allowing 500 ma charging current) ? korean tablet charging mode (d+ and d- shorted and pulled up to a certain voltage) figure 4. typical application diagram 1. c vbus required by the usb specification. ". 45$$ 7 */ 7gspnijhiqpxfs4.14 $ */ $ 065 3 16@$)( 3 16@'"6-5 $)"3(*/( '"6-5 $)"3(*/( '"6-5 1pxfsboeebubtxjudifobcmf .pef tfmfdu */ &/ $5- $5- $5- *-*. (/% 1"% 065 %.@*/ %1@*/ %.@065 %1@065 64# dpoofdups $ 7#64
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application information stcc2540 12/32 docid024711 rev 6 5.1 supported modes for more information refer to section 5.4: state machine . the stcc2540 device supports the following modes: ? sdp bc1.2 ? cdp bc1.2 ? sdp with remote wakeup for all usb devices ? cdp with remote wakeup for low-speed usb devices with automatic transition to dcp auto mode if a full-speed/high-speed usb device attached or after a usb device detached. ? dcp auto-detect: this mode permits auto-detection of charging modes between dcp bc1.2 (shorted d+, d-) and divider char ging mode. it also supports blackberry charging mode and can charge legacy devices and korean tablets. ? forced dcp bc1.2 mode ? forced dcp divider mode the auto-detect mode starts in divider mode. if charging negotiation attempt is detected, there is an automatic transition to dcp bc1.2 mode. it is preceded by v bus discharge pulse to initialize the proper bc1.2 handshake process. if the bc1.2 device is detached, the circuit automatically returns to divider mode after a 10 s (typ.) timeout. note: from an application point of view it means that after removing one device the user should wait for approx. 15 s before attaching another device. selection between these modes is done throug h the ctlx control pins. the ctlx pins may be controlled by the host in different ways: ? gpio from embedded controller ? hardware signals from usb host controller (slp_s3#, slp_s4#) and ac_adapter signal from embedded controller ? hardware signals suspend from embedded controller and ac_adapter. table 5. truth table control pins ctlx (1) host state ctl1 ctl2 ctl3 mode description 0 0 0 device off, output discharge s0, s1, (s3) (2) 110sdp s0, s1, (s3) (2) 1 1 1 cdp bc1.2 with charging detection. s3, (s0, s1) (2) 0 1 0 sdp with remote wakeup for all usb devices s3 0 1 1 cdp with remote wakeup for low-speed usb devices / dcp auto mode for full-speed or high-speed usb devices or after a usb device detached. s4, s5 0 0 1 dcp auto-detect mode without remote wakeup, with charging detection s4, s5 1 0 1 forced dcp divider mode with charging detection s4, s5 1 0 0 forced dcp bc1.2 mode with charging detection 1. on the transition from the ctlx = 111 to ctlx = 001, a synchronous transition of the ctl1 and ctl2 must be ensured. 2. see section 5.2 for further information.
docid024711 rev 6 13/32 stcc2540 application information 32 5.2 remote wakeup in s3 for more information refer to section 5.4: state machine . if the ctlx pins are controlled by hardware signals (s uch as slp_sx# or suspend), the ctlx combination changes when host transitions from s0 to s3 and back. in this case, the stcc2540 device can support remote wakeup of portable devices for the following transitions (i.e. no v bus discharge pulse and data switch on): ? sdp s0 (ctlx = 110) to and from sdp s3 (ctlx = 010) fo r all usb devices ? sdp (ctlx = x10) and cdp s0 (ctlx = 111) to and from cdp s3 (clx = 011) for low- speed usb devices only. if the host system is in s3 mode (ctlx = 011) , the system automatica lly turns into dcp auto mode for already attached full-speed / high-speed usb devices or after any usb device is detached. thus, already attached full-speed / high-speed devices or ne wly attached devices are charged without the need of ctlx transition. if the s0 to s3 transition is managed by gp io from the embedded controller, the easiest solution is to keep the same levels on the ctlx pins (sdp or cdp modes). therefore, remote wakeup in s3 is supported for all usb devices but the system does not automatically turn in to dcp auto mode. 5.3 v bus discharge the v bus discharge pulse lasts for 350 ms typ. (t vbus_reapp ) and is performed for any transitions between the modes listed in table 5 , except the modes a llowing remote wakeup in s3 [transitions (x10) and (111) to/from (011)] (see section 5.4 ). permanent output discharge is provided in following modes: ? en = 0, ctlx = xxx (ignored) ? en = 1, ctlx = 000.
application information stcc2540 14/32 docid024711 rev 6 5.4 state machine figure 5. state machine $ 67$7 ( wudqvlwlrq $ 'lvfkdujh pv ',6& + 25 (1 ' ri ',6& + $ '&3 vkruw $ '&3 glylghu 127 127 $ 6863(1' 'lvfrqqhfw $1' 25 $ 6'3 $ &'3 25 127 25 $ '&3 dxwr 127 25 5(6(7 25 $ '&3 wudqvlwlrq 127 25 25 25 '&3 127 25 $0
docid024711 rev 6 15/32 stcc2540 application information 32 5.5 charging detection the stcc2540 device continuously monitors the current drawn by the portable device. while programmed in cdp or dcp mode, the stcc2540 device sends a charging flag to the system if the current through the usb power switch is above the charging threshold, set at 20 ma typ.: open drain active low output charging is asserted. note: in cdp mode, the charging flag is asse rted only if the cdp handshaking between the portable device and the host is performed be fore the current is above the threshold. if a device is charging (cdp mode) while the system is tu rned off and the battery supplied, the risk is that the charging process stops before the end of charge due to the system power-off. to avoid this, the flag charging can be used by the host to prevent the switching-off of the high power dc-dc converter when the host goes to s5 state, even if battery supplied. after the charging current drops below the threshold and the deglitch delay expires, the charging output is deasserted. 5.6 power switch overcurrent conditions when an overcurrent condition is detected, the device maintains a constant output current and reduces the voltage accordingly. there are two overload conditions: ? the first occurs when a short-circuit or a pa rtial short-circuit is already present when the device is being powered-up or enabled. the output voltage is held near zero potential with respect to ground and the stcc2540 device ramps the output current to i os until the overload conditio n is removed or the devi ce starts thermal cycle. ? the second condition is when a short-circuit, a partial short-circuit, or a transient overload occurs while the device is already enabled and powered-on. the stcc2540 device responds to an overcurrent condition within time t ios . the current-sense amplifier is overdriven during this time an d momentarily disables the internal current limit mosfet. it then recovers and ramps the output current to i os . similar to previous conditions, it limits output curr ent to i os until the overload condition is removed or thermal cycle starts. thermal protection the stcc2540 device has an internal thermal sensing circuit which monitors the operating temperature of the circuit. it disables the po wer switch operation if the die temperature exceeds temperature threshold t stop , set at 150 c. the switch turns on if the temperature has cooled down by 20 c. undervoltage lockout the uvlo circuit disables the circuit until the input voltage reaches the uvlo turn-on threshold. built-in hysteresis prevents unw anted on/off cycling due to input voltage drop during turn-on.
application information stcc2540 16/32 docid024711 rev 6 fault functionality the fault open drain active low output is asserted during overcurrent or overtemperature conditions. signal is asserted until the fault is removed. for overcurrent conditions, the stcc2540 device is designed to eliminate false fault reporting, by using an internal deglitch delay (9 ms typ.). in the case of overtemperature, there is no deglitch delay and the fault signal is asserted immediately. it is deasserted with a delay afte r the device has cooled down and begins to turn on. this unidirectional glitch immunity prevents fault oscillation during an overtemperature event. in the case of a fault condition, the host may disable the power switch by toggling en input to logic low. current limit programming the current limit can be adjusted by an exte rnal resistor in the range 500 ma to 2.8 a (max.). the programming resistor may be calculated using these equations: equation 1 equation 2 equation 3 equation 2 and equation 3 allow the minimum and maximum variation to be estimated around the typical value predefined by the external resistor, r ilim , given in equation 1 . equation 2 and equation 3 do not take into consideration external resistor variations. 5.7 enable input the enable input (en, active high) serves to turn off the stcc2540 device and achieve the lowest current consumption. the behavior of the stcc2540 in disabled state (en = 0) is following: ? power switch, usb data switch and emulation profiles are turned off ? output discharge circuit is turned on ? the fault and charging flags are cleared (the fault and charging outputs are set to hi-z mode). i os typ () 48000 r ilim ---------------- = ma k , () () 48000 r ilim 1.037 -------------------------- = ma k , () () 48000 r ilim 0.962 -------------------------- = ma k , ()
docid024711 rev 6 17/32 stcc2540 application information 32 5.8 input and output capacitors for proper functionality, the stcc2540 device requires two 1 f decoupling ceramic capacitors c in and c out (see figure 4 ). these capacitors shou ld be placed as close as possible to the corresponding pins. the electrolytic capacitor c vbus (see figure 4 ) is required by the usb specification to suppress the voltage and current transients caused by hot plugging/unplugging the peripheral devices. this capaci tor should be placed as close as possible to the usb connector. the recommended value is 150 f, low esr type is preferred. if the v in supply path is longer than approx. 150 mm, an additional capacitor is required and should be connected in parallel with the c in to suppress v in overvoltage transients caused by supply path inductance and fast current changes. the minimum value is 10 f, and a low esr type is preferred.
typical operating characteristics stcc2540 18/32 docid024711 rev 6 6 typical operating characteristics figure 6. power switch on resistance vs. temperature figure 7. out discharge resistance vs. temperature 5 21 ,1287 -xqfwlrqwhpshudwxuh> ? &@ $0 5 ',6&+$5*( -xqfwlrqwhpshudwxuh> &@ $0
docid024711 rev 6 19/32 stcc2540 typical operating characteristics 32 figure 8. out short-circuit current limit vs. temperature (r ilim = 96 k ) figure 9. out short-circuit current limit vs. temperature (r ilim = 33 k ) , 26 >p$@ -xqfwlrqwhpshudwxuh> &@ $0 , 26 >p$@ -xqfwlrqwhpshudwxuh> &@ $0
typical operating characteristics stcc2540 20/32 docid024711 rev 6 figure 10. out short-circuit cu rrent limit vs. temperature (r ilim = 19.6 k ) figure 11. disabled in supply current vs. temperature , 26 >p$@ -xqfwlrqwhpshudwxuh> &@ $0 , ,1',6$%/(' > $@ -xqfwlrqwhpshudwxuh> &@ $0
docid024711 rev 6 21/32 stcc2540 typical operating characteristics 32 figure 12. enabled in supply current vs. temperature (sdp mode) figure 13. enabled in supply current vs. temperature (cdp mode) $0 , ,1$&7,9( 6'3 > $@ -xqfwlrqwhpshudwxuh> &@ , ,1$&7,9( &'3 > $@ -xqfwlrqwhpshudwxuh> &@ $0
typical operating characteristics stcc2540 22/32 docid024711 rev 6 figure 14. enabled in supply current vs. temperature (dcp auto-mode) figure 15. enabled in supply current vs. temperature (dcp bc1.2 mode) , ,1$&7,9( '&3dxwr > $@ -xqfwlrqwhpshudwxuh> &@ $0 , ,1$&7,9( '&3%& > $@ -xqfwlrqwhpshudwxuh> &@ $0
docid024711 rev 6 23/32 stcc2540 typical operating characteristics 32 figure 16. enabled in supply current vs. temperature (dcp divider mode) figure 17. data switch transfer characteristics vs. frequency , ,1$&7,9( '&3glylghu > $@ -xqfwlrqwhpshudwxuh> &@ $0
typical operating characteristics stcc2540 24/32 docid024711 rev 6 figure 18. eye diagram using usb compli ance test pattern - without stcc2540 (deskew line + cable) figure 19. eye diagram using usb compliance test pattern - with stcc2540 (stcc2540 + cable)
docid024711 rev 6 25/32 stcc2540 typical operating characteristics 32 figure 20. turn-on response (r ilim = 20 k , r load = 5 , c load = 150 f) figure 21. turn-off response (r load = 5 , c load = 150 f)
typical operating characteristics stcc2540 26/32 docid024711 rev 6 figure 22. device enabled into short-circuit (r ilim = 80.6 k ) figure 23. device enabled into short-circuit - thermal cycling (r ilim = 20 k )
docid024711 rev 6 27/32 stcc2540 typical operating characteristics 32 figure 24. short-circuit to full load recovery (r ilim = 20 k , r load = 5 , c load = 150 f)
package information stcc2540 28/32 docid024711 rev 6 7 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack specifications, grade definitions a nd product status are available at: www.st.com . ecopack is an st trademark. figure 25. vfqfpn 16l 3 x 3 x 0.8 mm with exposed pad 1.7 package outline 9)4)31/
docid024711 rev 6 29/32 stcc2540 package information 32 figure 26. vfqfpn 16l 3 x 3 x 0.8 mm with exposed pad 1.7 footprint recommended table 6. vfqfpn 16l 3 x 3 x 0.8 mm with exposed pad 1.7 package mechanical data (1) , (2) , (3) , (4) 1. vfqfpn - standard for ?thermally enhanced very thin fine pitch quad flat package no leads?. 2. the lead size is comprehensive of the thickness of the lead finishing material. 3. dimensions do not include mold protrusion, not to exceed 0.15 mm. 4. package outline exclusive of metal burr dimensions. symbol dimensions notes data book (mm) nom. min. max. a 0.75 0.70 0.80 a1 0.02 0 0.05 a3 0.20 b 0.25 0.18 0.30 d 3 2.90 3.10 d2 1.70 1.50 1.80 e 3 2.90 3.10 e2 1.70 1.50 1.80 e 0.50 l 0.40 0.30 0.50 (5) 5. the value of ?l?, a jedec norm, is min. 0.35 ? max. 0.45. $0
ordering information stcc2540 30/32 docid024711 rev 6 8 ordering information table 7. order codes order code temperature range marking package packaging STCC2540IQTR -40 to 85 c 2540cc vfqfpn 16l tape and reel
docid024711 rev 6 31/32 stcc2540 revision history 32 9 revision history table 8. document revision history date revision changes 29-may-2013 1 initial release. 24-jun-2013 2 updated features on page 1 (added ?cb? components). updated section 1: functional description (replaced 1000 mhz by 1100 mhz). updated table 2 (added note 3. ). updated table 4 (updated parameters and conditions for i reverse , ien, iol(fault ), i ctlx, i ol(charging ) , added typ. value for x talk, o irr, and b w, removed t pd and t sk symbols). added figure 4 on page 11 . added note: in section 5.1: supported modes . added section 5.8: input and output capacitors . added section 6: typical operating characteristics . 06-dec-2013 3 updated table 4 (updated min. conditions for i os - r ilim 96 k and r ilim 33 k ). updated table 5 (updated host state column, added footnote 1. and 2. below table). updated section 5.7 (replaced equation by equation 1 to equation 3 ). minor modifications throughout document. 06-jan-2014 4 corrected units in table 4 on page 7 (replaced ?w? by ? ? in r discharge , r on and r dcp_res symbols). 08-jan-2014 5 updated section : features on page 1 (removed ?2.5 a? from ?integrated v bus power switch with low r on of 65 m ? replaced ?2.5 a? by ?2 .8 a (max.)? in ?adjustable current limit? ). added list of figures on page 3 . updated section 1: functional description on page 3 [replaced ?2.5 a? by ?2.8 a (max.)?]. updated table 4 on page 7 (added ?r ilim = 17.2 k ? and typ. conditions of ?r ilim = 17.2 k ? for i os symbol). updated section : current limit programming on page 16 [replaced ?2.5 a (typ. )? by ?2.8 a (max.)?]. 25-feb-2014 6 removed list of figures on page 3 section 5.6: power switch : updated equation 2 and equation 3 and added explanation of same. table 7: order codes : updated ?marking? of STCC2540IQTR
stcc2540 32/32 docid024711 rev 6 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems wi th product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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